JPH0526170Y2 - - Google Patents
Info
- Publication number
- JPH0526170Y2 JPH0526170Y2 JP1987108517U JP10851787U JPH0526170Y2 JP H0526170 Y2 JPH0526170 Y2 JP H0526170Y2 JP 1987108517 U JP1987108517 U JP 1987108517U JP 10851787 U JP10851787 U JP 10851787U JP H0526170 Y2 JPH0526170 Y2 JP H0526170Y2
- Authority
- JP
- Japan
- Prior art keywords
- panel
- exterior
- base material
- pair
- heat insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Building Environments (AREA)
- Finishing Walls (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987108517U JPH0526170Y2 (en]) | 1987-07-14 | 1987-07-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987108517U JPH0526170Y2 (en]) | 1987-07-14 | 1987-07-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6412819U JPS6412819U (en]) | 1989-01-23 |
JPH0526170Y2 true JPH0526170Y2 (en]) | 1993-07-01 |
Family
ID=31343926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987108517U Expired - Lifetime JPH0526170Y2 (en]) | 1987-07-14 | 1987-07-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0526170Y2 (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10807376B2 (en) | 2010-05-21 | 2020-10-20 | Hewlett-Packard Development Company, L.P. | Fluid ejection device including recirculation system |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54131310A (en) * | 1978-04-03 | 1979-10-12 | Sekisui House Kk | Frame for constructing wall and wall inside ventilating method |
JPS6084611U (ja) * | 1983-11-17 | 1985-06-11 | 大下 一義 | コ−ナ−用断熱材 |
-
1987
- 1987-07-14 JP JP1987108517U patent/JPH0526170Y2/ja not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10807376B2 (en) | 2010-05-21 | 2020-10-20 | Hewlett-Packard Development Company, L.P. | Fluid ejection device including recirculation system |
US11260668B2 (en) | 2010-05-21 | 2022-03-01 | Hewlett-Packard Development Company, L.P. | Fluid ejection device including recirculation system |
Also Published As
Publication number | Publication date |
---|---|
JPS6412819U (en]) | 1989-01-23 |
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